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Research Brief
Malaysia · AI Infrastructure

Malaysia AI Infrastructure Report 2026

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$4.04B
DC market 2024
USD
$13.57B
DC market 2030E
22.4% CAGR
29%
AI DC CAGR
2025–30
5GW
DC load 2035E
~40% grid
12mo
TNB connect
green lane
7%
MAPC share target
2035 target

This report's view

  1. Market Trends
    DC market USD 4.04bn (2024) to USD 13.57bn (2030), 22.38% CAGR; pure AI DC CAGR 29.03%.
  2. Positioning
    Emerging as an AI infrastructure and advanced packaging node beyond spillover hosting.
  3. Policy
    DESAC and TNB ~12-month grid pathway shape execution timelines.
  4. Supply Chain
    Liquid cooling, green PPAs, and MAPC packaging are key collaboration layers.
  5. Risks
    Industry forecast: DC load ~5GW by 2035E; WUE design baseline <2.2 m³/MWh.

This report's view: Competition shifts to energy, packaging, and coordination. DC market USD 4.04→13.57bn (2030E, industry estimate); DayOne ~USD 7B, ByteDance RM29.5bn+; grid load 5GW (2035E, industry estimate).

Key takeaways：

  1. Positioning: From spillover host toward AI compute and packaging node.
  2. Capital density: Large commitments in Johor from DayOne, ByteDance, and others.
  3. Mid-packaging: MAPC HBM4 pilot; 7% global share target by 2035.
  4. Compliance gate: DESAC ties incentives to local hiring and LVDP.
  5. Valuation shift: Power density and green power access gain weight.
Fig. 1 | Data centre market (USD bn)
2024 vs 2030E.
Fig. 2 | Pure AI DC market
2025 vs 2030E.
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